PT2305 데이터 시트보기 (PDF) - Princeton Technology

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PT2305

2.5W × 2 Class AB Audio Power Amplifier

Princeton Technology 

Tel: 886-2-66296288

Fax: 886-2-29174598

URL: http://www.princeton.com.tw

2.5W × 2 Class AB Audio Power Amplifier

PT2305

HEAT DISSIPATION

During normal operation, the chip only consumes very little stand-by current. In high output power

conditions, the package temperature will rise. For proper operating temperature, a modest heat sink

mounted on the top side of the chip is required. The thermal resistance requirement of the heat sink

demand may be obtained by the formula below:

θJA = (TJ(max) – TA) ÷ PDISS

PDISS = IC dissipation power

TJ (max) = Maximum chip conjunction temperature

TA = external environment temperature

θJA = thermal resistance from chip conjunction to ambience environment

With 60% estimated efficiency (eff), PT2305 in 2W + 2W output power dissipation is probably

PDISS = ( Po ÷ eff ) - Po = 2.6W

The maximum chip conjunction temperature is 150°C. Exceeding this temperature will damage the

chip, assuming the outside environment air temperature is 50°C. From the chip conjunction dissipation

to external environment thermal resistance θJA should be:

θJA = ( 150 – 50 ) ÷ 2.6 = 38.4℃/W

The PT2305 chip conjunction to case thermal resistance θJC is 26℃ /W. Therefore the heat sink

thermal resistance should be:

θJA –θJC = 12.4℃/W

In normal operating, no need extra heat sink, only utilize the ground (copper foil) of PCB to heat

dissipation.

PT2305 V1.1

-7-

May, 2005

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