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1117 데이터 시트보기 (PDF) - Linear Technology

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1117 Datasheet PDF : 12 Pages
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LT1117/LT1117-2.85
LT1117-3.3/LT1117-5
SOLDERI G ETHODS
The SOT-223 is manufactured with gull wing leadform for
surface mount applications. The leads and heat sink are
solder plated and allow easy soldering using nonactive or
mildly active fluxes. The package is constructed with three
leads exiting one side of the package and one heat sink
exiting the other side, and the die attached to the heat sink
internally.
The recommended methods of soldering SOT-223 are:
vapor phase reflow and infrared reflow with preheat of
component to within 65°C of the solder temperature. Hand
soldering and wave soldering are not recommended since
these methods can easily damage the part with excessive
thermal gradients across the package.
Care must be exercised during surface mount to minimize
large (> 30°C per second) thermal shock to the package.
LT1117 • TA15
PACKAGE DESCRIPTIO
0.256
(6.502)
0.060
(1.524)
0.060
(1.524)
0.183
(4.648)
0.075
(1.905)
0.300
(7.620)
BOTTOM VIEW OF DD PAK
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK
Dimensions in inches (millimeters) unless otherwise noted.
0.060
(1.524)
TYP
M Package
3-Lead Plastic DD Pak
(LTC DWG # 05-08-1460)
0.390 – 0.415
(9.906 – 10.541)
15° TYP
0.330 – 0.370
(8.382 – 9.398)
0.165 – 0.180
(4.191 – 4.572)
0.059
(1.499)
TYP
0.045 – 0.055
(1.143 – 1.397)
0.004
+0.008
–0.004
( ) 0.102
+0.203
–0.102
0.095 – 0.115
(2.413 – 2.921)
0.143
+0.012
– 0.020
( ) 3.632
+0.305
–0.508
0.050
(1.270)
BSC
0.090 – 0.110
(2.286 – 2.794)
0.013 – 0.023
(0.330 – 0.584)
0.050 ± 0.012
(1.270 ± 0.305)
M (DD3) 1098
0.248 – 0.264
(6.30 – 6.71)
0.114 – 0.124
(2.90 – 3.15)
ST Package
3-Lead Plastic SOT-223
(LTC DWG # 05-08-1630)
0.264 – 0.287
(6.70 – 7.30)
0.130 – 0.146
(3.30 – 3.71)
0.0905
(2.30)
NOM
0.071
(1.80)
MAX
0.033 – 0.041
(0.84 – 1.04)
0.024 – 0.033
(0.60 – 0.84)
0.181
(4.60)
NOM
10° – 16°
10°
MAX
0.012
(0.31)
MIN
0.010 – 0.014
(0.25 – 0.36)
0.0008 – 0.0040
(0.0203 – 0.1016)
10° – 16°
ST3 (SOT-233) 1298
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11

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