RMPA0959 데이터 시트보기 (PDF) - Fairchild Semiconductor
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RMPA0959 Datasheet PDF : 13 Pages
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Application Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE
Precautions to Avoid Permanent Device
Damage:
• Cleanliness: Observe proper handling procedures
to ensure clean devices and PCBs. Devices
should remain in their original packaging until
component placement to ensure no contamination
or damage to RF, DC & ground contact areas.
• Device Cleaning: Standard board cleaning
techniques should not present device problems
provided that the boards are properly dried to
remove solvents or water residues.
Solder Materials & Temperature Profile: Reflow
soldering is the preferred method of SMT
attachment. Hand soldering is not recommended.
• Reflow Profile
– Ramp-up: During this stage the solvents are
evaporated from the solder paste. Care should
be taken to prevent rapid oxidation (or paste
slump) and solder bursts caused by violent
solvent out-gassing. A typical heating rate is 1-
2°C/sec.
• Static Sensitivity: Follow ESD precautions to
protect against ESD damage:
– A properly grounded static-dissipative surface
on which to place devices.
– Static-dissipative floor or mat.
– A properly grounded conductive wrist strap for
each person to wear while handling devices.
• General Handling: Handle the package on the top
with a vacuum collet or along the edges with a
sharp pair of bent tweezers. Avoiding damaging
the RF, DC, & ground contacts on the package
bottom. Do not apply excessive pressure to the top
of the lid.
• Device Storage: Devices are supplied in heat-
sealed, moisture-barrier bags. In this condition,
devices are protected and require no special
storage conditions. Once the sealed bag has been
opened, devices should be stored in a dry nitrogen
environment.
Device Usage:
Fairchild recommends the following procedures prior
to assembly.
– Pre-heat/soak: The soak temperature stage
serves two purposes; the flux is activated and
the board and devices achieve a uniform
temperature. The recommended soak condition
is: 120-150 seconds at 150°C.
– Reflow Zone: If the temperature is too high, then
devices may be damaged by mechanical stress
due to thermal mismatch or there may be
problems due to excessive solder oxidation.
Excessive time at temperature can enhance the
formation of inter-metallic compounds at the
lead/board interface and may lead to early
mechanical failure of the joint. Reflow must
occur prior to the flux being completely driven
off. The duration of peak reflow temperature
should not exceed 10 seconds. Maximum
soldering temperatures should be in the range
215-220°C, with a maximum limit of 225°C.
– Cooling Zone: Steep thermal gradients may give
rise to excessive thermal shock. However, rapid
cooling promotes a finer grain structure and a
more crack-resistant solder joint. The illustration
below indicates the recommended soldering
profile.
• Dry-bake devices at 125°C for 24 hours minimum.
Note: The shipping trays cannot withstand 125°C
baking temperature.
• Assemble the dry-baked devices within 7 days of
removal from the oven.
Solder Joint Characteristics:
Proper operation of this device depends on a reliable
void-free attachment of the heatsink to the PWB. The
solder joint should be 95% void-free and be a
consistent thickness.
• During the 7-day period, the devices must be
stored in an environment of less than 60% relative
humidity and a maximum temperature of 30°C
• If the 7-day period or the environmental conditions
have been exceeded, then the dry-bake procedure
must be repeated.
Rework Considerations:
Rework of a device attached to a board is limited to
reflow of the solder with a heat gun. The device
should not be subjected to more than 225°C and
reflow solder in the molten state for more than 5
seconds. No more than 2 rework operations should
be performed.
RMPA0959 Rev. F
11
www.fairchildsemi.com
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