RMPA1963 데이터 시트보기 (PDF) - Fairchild Semiconductor
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RMPA1963 Datasheet PDF : 7 Pages
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Applications Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE.
Precautions to Avoid Permanent Device Damage:
Solder Materials & Temperature Profile:
• Cleanliness: Observe proper handling procedures to ensure
clean devices and PCBs. Devices should remain in their
original packaging until component placement to ensure no
Reflow soldering is the preferred method of SMT attachment.
Hand soldering is not recommended.
Reflow Profile
i-L
o
™
contamination or damage to RF, DC and ground contact
areas.
• Ramp-up: During this stage the solvents are evaporated from
the solder paste. Care should be taken to prevent rapid
• Device Cleaning: Standard board cleaning techniques should
oxidation (or paste slump) and solder bursts caused by violent
not present device problems provided that the boards are
solvent out-gassing. A maximum heating rate is 3°C/sec.
properly dried to remove solvents or water residues.
• Pre-heat/soak: The soak temperature stage serves two
• Static Sensitivity: Follow ESD precautions to protect against
purposes; the flux is activated and the board and devices
ESD damage:
achieve a uniform temperature. The recommended soak
– A properly grounded static-dissipative surface on which to
condition is: 60-180 seconds at 150-200°C.
place devices.
• Reflow Zone: If the temperature is too high, then devices may
– Static-dissipative floor or mat.
be damaged by mechanical stress due to thermal mismatch or
– A properly grounded conductive wrist strap for each person
to wear while handling devices.
there may be problems due to excessive solder oxidation.
Excessive time at temperature can enhance the formation of
inter-metallic compounds at the lead/board interface and may
• General Handling: Handle the package on the top with a
lead to early mechanical failure of the joint. Reflow must occur
vacuum collet or along the edges with a sharp pair of bent
prior to the flux being completely driven off. The duration of
tweezers. Avoiding damaging the RF, DC, and ground
peak reflow temperature should not exceed 20 seconds.
contacts on the package bottom. Do not apply excessive
Soldering temperatures should be in the range 255–260°C,
pressure to the top of the lid.
with a maximum limit of 260°C.
• Device Storage: Devices are supplied in heat-sealed,
moisture-barrier bags. In this condition, devices are protected
and require no special storage conditions. Once the sealed
bag has been opened, devices should be stored in a dry
nitrogen environment.
• Cooling Zone: Steep thermal gradients may give rise to
excessive thermal shock. However, rapid cooling promotes a
finer grain structure and a more crack-resistant solder joint.
The illustration below indicates the recommended soldering
profile.
Device Usage:
Fairchild recommends the following procedures prior to
assembly.
• Assemble the devices within 7 days of removal from the dry
pack.
• During the 7-day period, the devices must be stored in an
environment of less than 60% relative humidity and a
maximum temperature of 30°C
• If the 7-day period or the environmental conditions have been
exceeded, then the dry-bake procedure, at 125°C for 24 hours
minimum, must be performed.
Solder Joint Characteristics:
Proper operation of this device depends on a reliable void-free
attachment of the heat sink to the PWB. The solder joint should
be 95% void-free and be a consistent thickness.
Rework Considerations:
Rework of a device attached to a board is limited to reflow of the
solder with a heat gun. The device should be subjected to no
more than 15°C above the solder melting temperature for no
more than 5 seconds. No more than 2 rework operations should
be performed.
Recommended Solder Reflow Profile
260
217
200
150
100
50
25
RMPA1963 i-Lo™ Rev. H
Ramp-Up Rate
3 °C/sec max
Preheat, 150 to 200 °C
60 - 180 sec
Ramp-Up Rate
3 °C/sec max
Time 25 °C/sec to peak temp
6 minutes max
Time (Sec)
6
Peak temp
260 +0/-5 °C
10 - 20 sec
Time above
liquidus temp
60 - 150 sec
Ramp-Down Rate
6 °C/sec max
www.fairchildsemi.com
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