RT8286 데이터 시트보기 (PDF) - Richtek Technology
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RT8286 Datasheet PDF : 14 Pages
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RT8286
Typical Application Circuit
VIN
1 VIN
BOOT 4
CIN
22µF
RT8286
SW 2, 3
CBOOT
100nF L
Chip Enable
5 EN
8, 9 (Exposed Pad)
GND
6
FB
VCC 7
RT
CC
0.1µF
R1
R2
VOUT
COUT
VOUT (V)
5
3.3
2.5
1.8
1.5
1.2
1.05
Table 1. Recommended Components Selection
R1 (kΩ)
75
R2 (kΩ)
14.46
RT (kΩ)
0
L (μH)
4.7
75
24.32
0
3.6
75
35.82
0
3.6
5
4.07
30
2
5
5.84
39
2
5
10.31
47
2
5
16.69
47
1.5
COUT (μF)
22 x 2
22 x 2
22 x 2
22 x 2
22 x 2
22 x 2
22 x 2
Functional Pin Description
Pin No.
Pin Name
Pin Function
1
VIN
2, 3
SW
4
BOOT
5
EN
6
FB
7
VCC
8,
9 (Exposed Pad)
GND
Supply Input. VIN supplies the power to the IC, as well as the step-down converter
switches. Drive VIN with a 4.5V to 21V power source. Bypass VIN to GND with a
suitably large capacitor to eliminate noise on the input to the IC.
Switch Node. SW is the switching node that supplies power to the output. Connect
the output LC filter from SW to the output load. Note that a capacitor is required
from SW to BOOT to power the high side switch.
High Side Gate Drive Boost Input. BOOT supplies the drive for the high side
N-MOSFET switch. Connect a 100nF or greater capacitor from SW to BOOT to
power the high side switch.
Chip Enable (Active High). For automatic start up, connect the EN pin to VIN with
a 100kΩ resistor.
Feedback Input. FB senses the output voltage to regulate said voltage. Drive FB
with a resistive voltage divider from the output voltage. The feedback threshold is
0.808V.
Bias Supply. Decouple with 0.1μF to 0.22μF capacitor. The capacitance should be
no more than 0.22μF.
Ground. The Exposed Pad must be soldered to a large PCB and connected to
GND for maximum power dissipation.
Copyright ©2012 Richtek Technology Corporation. All rights reserved.
www.richtek.com
2
is a registered trademark of Richtek Technology Corporation.
DS8286-02 June 2012
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