TDA1908 데이터 시트보기 (PDF) - STMicroelectronics

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TDA1908

8W AUDIO AMPLIFIER

STMicroelectronics 

TDA1908

THERMAL SHUT-DOWN

The presence of a thermal limiting circuit offers the

following advantages:

1) An overload on the output (even if it is perma-

nent), or an abovelimit ambienttemperature can

be easily supported since the Tj cannot be

higher than 150°C.

2) The heatsink can have a smaller factor of safety

compared with that of a conventional circuit.

There is no possibility of device damage due to

high junction temperature.

If, for any reason, the junction temperature in-

crease up to 150°C, the thermal shut-down sim-

ply reduces the power dissipation and the

current consumption.

The maximum allowable power dissipation de-

pends upon the size of the external heatsink (i.e. its

thermal resistance); fig. 25 shows the dissipable

power as a function of ambient temperature for

different thermal resistance.

Figure 24. Output power

and drain current vs.

case temperature

Figure 25. Output power

and drain current vs.

case temperature

Figure 26. Maximum

power dissipation vs.

ambient temperature

MOUNTING INSTRUCTIONS

The thermal power dissipated in the circuit may be

removed by soldering the tabs to a copper area on

the PC board (see Fig. 27).

During soldering, tab temperature must not exceed

260°C and the soldering time must not be longer

than 12 seconds.

Figure 27. Mounding example

Figure 28. Maximum

power dissipation and

thermal resistance vs.

side ” ”

10/12

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