SA58631 데이터 시트보기 (PDF) - NXP Semiconductors.

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SA58631

3 W BTL audio amplifier

NXP Semiconductors. 

NXP Semiconductors

13. Application information

SA58631

3 W BTL audio amplifier

C1

R1

1 µF 11 kΩ

VI

R2

56 kΩ

IN− 4

IN+ 3

SVR 2

C2 MODE

47 µF

1

6

SA58631

100 nF

5 OUT−

RL

8 OUT+

7

GND

VCC

100 µF

002aac007

Gain = 2 × -RR----21-

Fig 3. Application diagram of SA58631 BTL differential output configuration

14. Test information

14.1 Test conditions

The junction to ambient thermal resistance, Rth(j-a) = 27.7 K/W for the HVSON8 package

when the exposed die attach paddle is soldered to 32 cm2 (5 in2) area of 35 µm (1 ounce)

copper heat spreader on the demo PCB. The maximum sine wave power dissipation for

Tamb = 25 °C is:

1----5---0----–-----2---5- = 4.5 W

27.7

Thus, for Tamb = +85 °C the maximum total power dissipation is:

1----5--2-0--7--–-.-7---8---5- = 2.35 W

The power dissipation versus ambient temperature curve (Figure 5) shows the power

derating profiles with ambient temperature for three sizes of heat spreaders. For a more

modest heat spreader using 9.7 cm2 (1.5 in2) area on the top side of the PCB, the

Rth(j-a) is 31.25 K/W. When the package is not soldered to a heat spreader, the Rth(j-a)

increases to 83.3 K/W.

SA58631_2

Product data sheet

Rev. 02 — 12 October 2007

© NXP B.V. 2007. All rights reserved.

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