Philips Semiconductors
Integrated VIP and teletext decoder
(IVT1.1X)
Preliminary specification
SAA5254
QUALITY AND RELIABILITY
This device will meet Philips Semiconductors General Quality Specification for Business group “Consumer Integrated
Circuits SNW-FQ-611-Part E”. The principal requirements are shown in Tables 1 to 4.
Group A
Table 1 Acceptance tests per lot
Mechanical
Electrical
TEST
CONDITIONS
REQUIREMENTS(1)
cumulative target < 100 ppm
cumulative target < 100 ppm
Group B
Table 2 Processability tests (by package family)
TEST
Solderability
Mechanical
Solder heat resistance
CONDITIONS
REQUIREMENTS(1)
< 7% LTPD
< 15% LTPD
< 15% LTPD
Group C
Table 3 Reliability tests (by process family)
TEST
Operational life
CONDITIONS
168 hours at Tj = 150 °C
Humidity life
Temperature cycling performance
temperature, humidity, bias
(1000 hours, 85 °C, 85% RH or
equivalent test)
Tstg(min) to Tstg(max)
REQUIREMENTS(1)
< 1500 FPM; equivalent to
< 100 FITS at Tj = 70 °C
< 2000 FPM
< 2000 FPM
Table 4 Reliability tests (by device type)
TEST
ESD and latch-up
CONDITIONS
ESD Human body model
2000 V, 100 pF, 1.5 kΩ
ESD Machine model
200 V, 100 pF, 1.5 kΩ
latch-up 100 mA, 1.5 × VDD
(absolute maximum)
Notes to Tables 1 to 4
1. ppm = fraction of defective devices, in parts per million.
LTPD = Lot Tolerance Percent Defective.
FPM = fraction of devices failing at test condition, in Failures Per Million.
FITS = Failures In Time Standard.
REQUIREMENTS(1)
< 15% LTPD
< 15% LTPD
< 15% LTPD
1996 Nov 07
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