SGM8061 데이터 시트보기 (PDF) - Shengbang Microelectronics Co, Ltd

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SGM8061

500MHz, Rail-to-Rail Output CMOS Operational Amplifier

Shengbang Microelectronics Co, Ltd 

MODEL

SGM8061

SGM8062

SGM8063

PACKAGE/ORDERING INFORMATION

ORDER

NUMBER

SGM8061XN5/TR

SGM8061XS/TR

SGM8062XS/TR

SGM8063XN6/TR

SGM8063XS/TR

PACKAGE

DESCRIPTION

SOT23-5

SO-8

SO-8

SOT23-6

SO-8

PACKAGE

OPTION

Tape and Reel, 3000

Tape and Reel,2500

Tape and Reel, 2500

Tape and Reel,3000

Tape and Reel,2500

MARKING

INFORMATION

8061

SGM8061XS

SGM8062XS

8063

SGM8063XS

ABSOLUTE MAXIMUM RATINGS

Supply Voltage, V+ to V- .......................................... 7.5 V

Common-Mode Input Voltage

........................................ (–VS) – 0.5 Vto (+VS) +0.5V

Storage Temperature Range ................. –65℃ to +150℃

Junction Temperature .............................................. 160℃

Operating Temperature Range ............ –55℃ to +150℃

Package Thermal Resistance @ TA = 25℃

SOT23-5, θJA......................................................... 190℃/W

SOT23-6, θJA......................................................... 190℃/W

SO-8, θJA................................................................ 125℃/W

Lead Temperature Range (Soldering 10 sec)

...................................................... 260℃

ESD Susceptibility

HBM...........................................................................1000V

MM...............................................................................400V

NOTES

1. Stresses above those listed under Absolute Maximum

Ratings may cause permanent damage to the device. This is a

stress rating only; functional operation of the device at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

CAUTION

This integrated circuit can be damaged by ESD.

Shengbang Micro-electronics recommends that all

integrated circuits be handled with appropriate

precautions. Failure to observe proper handling and

installation procedures can cause damage.

ESD damage can range from subtle performance

degradation to complete device failure. Precision

integrated circuits may be more susceptible to damage

because very small parametric changes could cause the

device not to meet its published specifications.

３

SGM8061/2/3

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