SI-8050W 데이터 시트보기 (PDF) - Sanken Electric co.,ltd.
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SI-8050W Datasheet PDF : 2 Pages
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SI-8000W Series
■External Dimensions (SOP8)
5.1±0.4
1.27
0.4±0.1
8
7
6
5
0.15+–00..105
1
2
3
4
1.27
0.995max.
0.4±0.1
0.10
0.12 M
■Block Diagram
VIN 1
Reg.
OCP
OSC
Reset
Comp.
Drive
Amp.
5 to 8
GND
VREF
3 SW
TSD
4 VOS
■Reference Data
Copper Laminate Area vs. Power Dissipation
Tj=100°C Area of PC board : 40 × 40mm
1.2
Ta=25°C
1
Ta=50°C
Ta=80°C
0.8
0.6
0.4
0.2
0
10
100
Copper Laminate Area (mm2)
(GND Terminal)
1000
Pin Assignment
q VIN
w N.C
e SW
r VOS
t GND
y GND
u GND
i GND
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.1g
(Unit : mm)
■Typical Connection Diagram
VIN
C1
100µF
L1
1
VIN
SI-8000W
SW 3
4
VOS
200µH
VO
+
GND
D1
5 to 8
SJPB-D4
(Sanken)
+
C2
330µF
GND
GND
Copper Laminate Area vs. Thermal Resistance θj-a
Area of PC board : 40 × 40mm
140
120
100
80
60
40
10
100
Copper Laminate Area (mm2)
(GND Terminal)
1000
ICs 15
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