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AN87C196CA-20 데이터 시트보기 (PDF) - Intel

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AN87C196CA-20 Datasheet PDF : 33 Pages
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87C196CA 87C196CB
PROCESS INFORMATION
These devices are manufactured on P629 5 a
CHMOS III-E process Additional process and reli-
ability information is available in Intel’s Components
Quality and Reliability Handbook Order Number
210997
All thermal impedance data is approximate for static
air conditions at 1 0W of power dissipation Values
will change depending on operation conditions and
application See the Intel Packaging Handbook (or-
der number 240800) for a description of Intel’s ther-
mal impedance test methodology
Figure 2 The 87C196CA CB Familiy Nomenclature
272405 – 2
Thermal Characteristics
Device and Package
AN87C196CB
(84-Lead PLCC Package)
iJA
35 0 C W
iJC
11 0 C W
AN87C196CA
36 5 C W 10 0 C W
(68-Lead PLCC Package)
NOTES
1 iJA e Thermal resistance between junction and the surrounding environment (ambient) measurements are taken 1 ft
away from case in air flow environment
iJC e Thermal resistance between junction and package face (case)
2 All values of iJA and iJC may fluctuate depending on the environment (with or without airflow and how much airflow)
and device power dissipation at temperature of operation Typical variations are g2 C W
3 Values listed are at a maximum power dissipation of 1 0W
3

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