SPLC783A
9. PACKAGE/PAD LOCATIONS ................................................................................................................................................................... 35
9.1. PAD ASSIGNMENT AND LOCATIONS....................................................................................................................................................... 35
9.2. PACKAGE INFORMATION ....................................................................................................................................................................... 35
9.3. ORDERING INFORMATION ..................................................................................................................................................................... 35
9.4. STORAGE CONDITION AND PERIOD FOR PACKAGE ................................................................................................................................. 36
9.5. RECOMMENDED SMT TEMPERATURE PROFILE...................................................................................................................................... 36
10. DISCLAIMER............................................................................................................................................................................................. 37
11. REVISION HISTORY ................................................................................................................................................................................. 38
FSoruPnpAlRusTMCoINnEfidRenUtsiael Only
© Sunplus Technology Co., Ltd.
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Proprietary & Confidential
MAR. 10, 2005
Version: 1.4