ST7573 데이터 시트보기 (PDF) - Sitronix Technology Co., Ltd.
부품명
상세내역
제조사
ST7573 Datasheet PDF : 46 Pages
| |||
2007/07/12
2/46
Ver 1.0b
Rough layout
For easy LCM design, the Power-1, Power-2 & Power-3 are identical (any one of them can be used).
Power-3 has VGI, VGS, V0O, V0I, V0S, XV0O, XV0I and XV0S which are not in Power-1 or Power-2.
Pitch
60.0
70.0
60.0
34.0
57.0
34.0
57.0
34.0
248~267
70.0
49~50
247~248
60.0
40~49
116~247
89.0
39~40
115~116
60.0
12~39
97~115
84.5
11~12
73~96
60.0
6~11
72~73
84.5
5~6
50~72
60.0
1~5
PAD
Pitch
PAD
PAD Pitch:
Bump Height: 15µm
Chip Thickness: 480µm
6074µm(X) x 720µm(Y)
Chip Size:
3. ST7573 Pad Arrangement (COG)
ST7573
Share Link: 