STPS2L25U(1999) 데이터 시트보기 (PDF) - STMicroelectronics
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STPS2L25U Datasheet PDF : 4 Pages
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STPS2L25U
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values).
IM(A)
10
9
8
7
6
5
4
3
2 IM
1
t
δ=0.5
0
1E-3
1E-2
t(s)
1E-1
Ta=25°C
Ta=50°C
Ta=100°C
1E+0
Fig. 4: Relative variation of thermal impedance
junction to ambient versus pulse duration.
Zth(j-a)/Rth(j-a)
1.0
0.8
0.6 δ = 0.5
0.4
δ = 0.2
0.2 δ = 0.1
0.0
1E-2
Single pulse
tp(s)
1E-1
1E+0
1E+1
T
δ=tp/T
tp
1E+2 5E+2
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values).
IR(mA)
1E+2
1E+1
1E+0
Tj=150°C
Tj=125°C
Tj=100°C
1E-1
1E-2
1E-3
0
Tj=25°C
VR(V)
5
10
15
20
25
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
500
F=1MHz
Tj=25°C
100
10
1
2
VR(V)
5
10
20 30
Fig. 7: Forward voltage drop versus forward cur-
rent (maximum values).
IFM(A)
10.00
Typical values
Tj=150°C
1.00
Tj=125°C
0.10
Tj=25°C
Tj=100°C
VFM(V)
0.01
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Fig. 8: Thermal resistance junction to ambient ver-
sus copper surface under each lead (Epoxy printed
circuit board FR4, copper thickness: 35µm).
Rth(j-a) (°C/W)
120
100
80
60
40
20
S(Cu) (cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
3/4
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