STPS2L30 데이터 시트보기 (PDF) - STMicroelectronics
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STPS2L30 Datasheet PDF : 14 Pages
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STPS2L30
Characteristics (curves)
Figure 13. Thermal resistance junction to ambient versus Figure 14. Thermal resistance junction to ambient versus
copper surface under each lead (SMA)
copper surface under each lead (SMB Flat)
Rth(j-a) (°C/W)
200
Epoxy printed circuit board FR4, copper thickness: 35 µm
150
SMA
200 Rth(j-a) (°C/W)
Epoxy printed circuit board FR4, eCu = 35 µm
150
SMB flat
100
100
50
S(Cu)(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
50
SCu(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat)
Rth(j-a) (°C/W)
200
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMAflat
150
100
50
S(Cu)(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DS1526 - Rev 7
page 5/14
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