Characteristics
STPS3030CT/CG/CR
Figure 7.
Reverse leakage current versus
reverse voltage applied (typical
values)
IR(mA)
1.E+03
Tj=150°C
1.E+02
Tj=125°C
Figure 8.
C(nF)
10.0
1.E+01
Tj=100°C
Tj=75°C
1.0
1.E+00
Tj=50°C
1.E-01
1.E-02
0
Tj=25°C
VR(V)
0.1
5
10
15
20
25
30
1
Junction capacitance versus
reverse voltage applied (typical
values)
F=1MHz
Vosc=30mV
Tj=25°C
VR(V)
10
100
Figure 9. Forward voltage drop versus
forward current
IFM(A)
100
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
10
Tj=25°C
(Maximum values)
VFM(V)
1
0.0
0.2
0.4
0.6
0.8
1.0
Figure 10.
Thermal resistance junction to
ambient versus copper surface
under tab (epoxy printed board
FR4, Cu = 35 µm)
Rth(j-a)(°C/W)
80
70
D²PAK
60
50
40
30
20
10
S(cm²)
0
1.2
0
5
10
15
20
25
30
35
40
4/9