STPS640CT/CF/CB
Fig. 7: Forward voltagedrop versus forwardcurrent
(maximum values, per diode).
IFM(A)
10.0
1.0
Typical values
Tj=150°C
Tj=125°C
VFM(V)
0.1
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Fig. 8: Thermal resistance junctionto ambient versus
copper surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35µm).
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
S(Cu) (cm )
0
0 4 8 12 16 20 24 28 32 36 40
PACKAGE MECHANICAL DATA
TO-220AB
H2
Dia
L2
F2
F1
F
G1
G
L5
L6
L9
L4
A
C
L7
D
M
E
REF.
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Diam.
DIMENSIONS
Millimeters
Inches
Min. Max. Min. Max.
4.40 4.60 0.173 0.181
1.23 1.32 0.048 0.051
2.40 2.72 0.094 0.107
0.49 0.70 0.019 0.027
0.61 0.88 0.024 0.034
1.14 1.70
1.14 1.70
4.95 5.15
2.40 2.70
10 10.40
16.4 typ.
0.044 0.066
0.044 0.066
0.194 0.202
0.094 0.106
0.393 0.409
0.645 typ.
13
14 0.511 0.551
2.65 2.95 0.104 0.116
15.25 15.75
6.20 6.60
3.50 3.93
2.6 typ.
0.600 0.620
0.244 0.259
0.137 0.154
0.102 typ.
3.75 3.85 0.147 0.151
4/6