RMBA09501A-58(2001) 데이터 시트보기 (PDF) - Raytheon Company
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RMBA09501A-58 Datasheet PDF : 6 Pages
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RMBA09501A-58
Cellular 2 Watt Linear GaAs MMIC Power
Amplifier
ADVANCED INFORMATION
Test Procedure
for the evaluation board
(RMBA09501A-58-TB)
CAUTION: LOSS OF GATE VOLTAGES (Vg1, Vg2) WHILE CORRESPONDING DRAIN VOLTAGES (Vdd) ARE
PRESENT CAN DAMAGE THE AMPLIFIER.
The following sequence must be followed to properly test the amplifier. (It is necessary to add a fan to provide air
cooling across the heat sink of RMBA09501A.) Note: Vdd1, 2 are tied together.
Step 1: Turn off RF input power.
Step 2: Use GND terminal of the evaluation board for
the ground of the DC supplies. Slowly apply
gate supply voltages as specified on results
sheet supplied with test board to the board
terminals Vgg1 and Vgg2.
Step 3: Slowly apply drain supply voltages of +7.0 V to
the board terminals Vdd1, 2. Adjust Vgg to set
the total quiescent current (with no RF applied)
Idq as per supplied result sheet. [Gate supply
voltages (Vgg i.e., Vgg1, Vgg2) may be
adjusted, only if quiescent current (Idq1 and
Idq2) values desired are different from those
noted on the data summary supplied with
product samples].
Step 4: After the bias condition is established, RF input
signal may now be applied at the appropriate
frequency band and appropriate power level.
Step 5: Follow turn-off sequence of:
(i) Turn off RF Input Power
(ii) Turn down and off drain voltages Vdd1, 2.
(iii) Turn down and off gate voltages Vgg1
and Vgg2.
Parts List
for Test Evaluation Board
(RMBA09501A-58-TB)
Part
Value
C1,C3,C10
C2
C8
C9
C4,C5,C11,C12
C6,C7
L1
L2
L3
R1
W1
U1
P3
P1,P2
Board
R2, R4
R3
R5
47 pF
5.6 pF
6.2 pF
6.8 pF
1000 pF
1.5 uF
5.6 nH
22 nH
39 nH
10 Ohm
26AWG (0.015” dia) Wire
RMBA09501-58, 3.5V PA
Right angle Pin Header
SMA Connectors
FR4
270 ohm
110 ohm
150 ohm
EIA Size
0402
0402
0402
0402
0402
3528
0603
0603
1008
0402
0402
0402
0402
Vendor(s)
Murata, GRM36COG470J050
Murata, GRM36COG5R6B050
Murata, GRM36COG6R2B050
Murata, GRM36COG6R8B050
Murata, GRM36X7R102K050
Kemet (T494B155K020AS)
Toko, LL1608-FH5N6S
Toko, LL608-FH22NK
Coilcraft, 1008HS-390TKBC
IMS, RCI-0402-10R0J
Alpha, 2853/1
Raytheon, G654257
3M (2340-5211TN)
Johnson Components (142-0701-841)
Raytheon Dwg# G654626, V1
IMS RCI 0402 2700J
IMS RCI 0402 1100J
IMS RCI 0402 1500J
Thermal
Considerations
for Heat Sinking the
RMBA09501A-58
PWB must be prepared with either an embedded copper slug in the board where the package is to be mounted or
a heat sink should be attached to the backside of PWB where the package is to be mounted on the front side.
Both the slug or the heat sink should be made of a highly conductive (electrical and thermal) material such as
copper or aluminum. The slug should be at least of the same thickness as PWB. In case of heat sink, a small
pedestal should protrude through a hole in the PWB where the package bottom is directly soldered. In either
configuration, the top surface of the slug or the pedestal should be made coplanar with the package lead
mounting plane i.e., the top surface of PWB.
Use Sn/Pb (67/37) solder (or Sn/Pn/Ag 62/36/2 solder) at 2200C for 20 seconds or less. The package bottom
should be firmly soldered to the slug or the pedestal while the pins are soldered to the respective pads on the
front side of the PWB without causing any stress on the pins. Remove flux completely if used for soldering.
www.raytheonrf.com
Characteristic performance data and specifications are subject to change without notice.
Revised November 14, 2001
Page 4
Raytheon RF Components
362 Lowell Street
Andover, MA 01810
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