TDA18272HNS 데이터 시트보기 (PDF) - NXP Semiconductors.

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TDA18272HNS

Hybrid (analog and digital) Silicon Tuner for terrestrial and cable TV reception

NXP Semiconductors. 

NXP Semiconductors

TDA18272HN

Hybrid Silicon Tuner for terrestrial and cable TV reception

6. Limiting values

Table 3. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter

Conditions

VCC

supply voltage

VI

input voltage

pins SDA and SCL

all other pins:

Tstg

Tj

Tamb

VESD

storage temperature

junction temperature

ambient temperature

electrostatic discharge voltage

VCC < 3.3 V

VCC > 3.3 V

EIA/JESD22-A114 (human body model)

EIA/JESD22-C101-C (FCDM) class III[2]

Min

Max

Unit

−0.3

+3.6

V

−0.3

+3.6

V

−0.3

−0.3

−40

-

−20

−2

750

VCC + 0.3 V

+3.6

V

+150

°C

125

°C

[1]

°C

+2

kV

-

V

[1] The maximum allowed ambient temperature Tamb(max) depends on the assembly conditions of the package and especially on the design

of the Printed-Circuit Board (PCB) and die connection. The application mounting must be done in such a way that the maximum junction

temperature is never exceeded. The junction temperature can be obtained by reading the temperature sensor bit via I2C-bus. The

junction temperature: Tj = Tamb + ΔTj-c. where ΔTj-c = power × Rth.

[2] Class III: 500 V to 1000 V.

7. Abbreviations

Table 4. Abbreviations

Acronym

Description

AGC

Automatic Gain Control

AGCK

Automatic Gain Control number K

CB

Citizens’ Band

DVB

Digital Video Broadcasting

DVB-T/T2/C/H

DVB-Terrestrial/Terrestrial second generation/Cable/Handheld

ESD

ElectroStatic Discharge

FCDM

Field-Induced Charged-Device Model

FRAC-N

FRACtional-N

IC

Integrated Circuit

IF

Intermediate Frequency

IRQ

Interrupt ReQuest

LC-VCO

Inductors and Capacitors - Voltage Controlled Oscillator

LNA

Low-Noise Amplifier

LO

Local Oscillator

PCB

Printed Circuit Board

RF

Radio Frequency

RoHS

Restriction on Hazardous Substances

SAW

Surface Acoustic Wave

TDA18272HN_SDS

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 2 — 11 August 2010

© NXP B.V. 2010. All rights reserved.

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