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TESDU12V 데이터 시트보기 (PDF) - TSC Corporation

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TESDU12V
TSC
TSC Corporation TSC
TESDU12V Datasheet PDF : 5 Pages
1 2 3 4 5
Small Signal Product
ORDER INFORMATION (EXAMPLE)
TESDU5V0 RZG
Green compound code
Packing code
Part no.
PACKAGE OUTLINE DIMENSIONS
0603
TESDU5V0/TESDU12V/TESDU24V
Taiwan Semiconductor
DIM.
A
B
C
D
E
Unit (mm)
Min Max
1.60 1.80
0.80 1.00
0.70 0.85
0.45 (Typ.)
0.70 (Typ.)
Unit (inch)
Min Max
0.063 0.071
0.031 0.039
0.028 0.033
0.018 (Typ.)
0.028 (Typ.)
SUGGEST PAD LAYOUT
DIM.
A
B
C
D
Unit (mm)
Typ.
0.60
1.00
0.65
1.85
Unit (inch)
Typ.
0.024
0.039
0.026
0.073
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts
may vary depending on application.
MARKING
Part NO.
TESDU5V0
TESDU12V
TESDU24V
Marking
E05
E12
E24
Document Number: DS_S1501027
Version: F15

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