TGA8300 데이터 시트보기 (PDF) - TriQuint Semiconductor

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TGA8300

Gain Block Amplifier

TriQuint Semiconductor 

MECHANICAL DRAWING

1,6256

(0.0640)

1,4199

(0.0559)

0,1702

(0.0067)

2

TGA8300-SCC

2,2073

(0.0869)

3

1,1227

(0.0442)

0,1803

1

(0.0071)

0

0,1524

0 (0.0060)

4

0,3073

(0.0121)

2,2047

(0.0868)

2,3622

(0.0930)

Units: millimeters (inches)

Thickness: 0,1524 (0.0060) (reference only)

Chip edge to bond pad dimensions are shown to center of bond pad.

Chip size tolerance: ± 0,0508 (0.0020)

Bond pad #1 (RF Input):

Bond pad #2 (V+):

Bond pad #3 (RF Output):

Bond pad #4 (V –):

0,1270 x 0,1016 (0.0050 x 0.0040)

0,1575 x 0,1245 (0.0062 x 0.0049)

0,1321 x 0,1016 (0.0052 x 0.0040)

0,0635 (0.0025) (radius)

7

TriQuint Semiconductor, Inc. • Texas Facilities • (972) 995-8465 • www.triquint.com

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