TJA1041 데이터 시트보기 (PDF) - Philips Electronics
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TJA1041 Datasheet PDF : 24 Pages
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Philips Semiconductors
High speed CAN transceiver
Product specification
TJA1041
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
VCC
DC voltage on pin VCC
VI/O
DC voltage on pin VI/O
VBAT
DC voltage on pin VBAT
VTXD
VRXD
VSTB
VEN
VERR
VINH
VWAKE
IWAKE
VCANH
VCANL
VSPLIT
Vtrt
Vesd
DC voltage on pin TXD
DC voltage on pin RXD
DC voltage on pin STB
DC voltage on pin EN
DC voltage on pin ERR
DC voltage on pin INH
DC voltage on pin WAKE
DC current on pin WAKE
DC voltage on pin CANH
DC voltage on pin CANL
DC voltage on pin SPLIT
transient voltages on
pins CANH, CANL, SPLIT
and VBAT
electrostatic discharge voltage
Tvj
virtual junction temperature
Tstg
storage temperature
CONDITIONS
no time limit
operating range
no time limit
operating range
no time limit
operating range
load dump
0 < VCC < 5.25 V; no time limit
0 < VCC < 5.25 V; no time limit
0 < VCC < 5.25 V; no time limit
according to ISO 7637; see Fig.6
MIN.
−0.3
4.75
−0.3
2.8
−0.3
5
−
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−
−27
−27
−27
−200
MAX.
UNIT
+6
V
5.25
V
+6
V
5.25
V
+40
V
27
V
40
V
VI/O + 0.3 V
VI/O + 0.3 V
VI/O + 0.3 V
VI/O + 0.3 V
VI/O + 0.3 V
VBAT + 0.3 V
VBAT + 0.3 V
−15
mA
+40
V
+40
V
+40
V
+200
V
Human Body Model (HBM); note 1
pins CANH, CANL and SPLIT −6
+6
kV
all other pins
−4
+4
kV
Machine Model (MM); note 2
−200 +200
V
note 3
−40
+150
°C
−55
+150
°C
Notes
1. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor.
2. Equivalent to discharging a 200 pF capacitor via a 0.75 µH series inductor and a 10 Ω series resistor.
3. Junction temperature in accordance with IEC 60747-1. An alternative definition is: Tvj = Tamb + P × Rth(vj-amb), where
Rth(vj-amb) is a fixed value. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient
temperature (Tamb).
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
Rth(j-s)
PARAMETER
CONDITIONS
thermal resistance from junction to ambient in SO14 package in free air
thermal resistance from junction to substrate of bare die
in free air
VALUE
120
40
UNIT
K/W
K/W
2003 Feb 13
11
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