TJA1050T/N1,118 데이터 시트보기 (PDF) - NXP Semiconductors.
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TJA1050T/N1,118 Datasheet PDF : 18 Pages
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Philips Semiconductors
High speed CAN transceiver
Product specification
TJA1050
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
Io(sc)(CANH)
short-circuit output current at VCANH = 0 V; VTXD = 0 V −45
−70
−95
mA
pin CANH
Io(sc)(CANL)
short-circuit output current at VCANL = 36 V;
pin CANL
VTXD = 0 V
45
70
100
mA
Vi(dif)(th)
differential receiver threshold −12 V < VCANL < +12 V; 0.5
0.7
0.9
V
voltage
−12 V < VCANH < +12 V;
see Fig.5
Vi(dif)(hys)
differential receiver input
−12 V < VCANL < +12 V; 50
70
100
mV
voltage hysteresis
−12 V < VCANH < +12 V;
see Fig.5
Ri(cm)(CANH)
common mode input
resistance at pin CANH
15
25
35
kΩ
Ri(cm)(CANL)
common mode input
resistance at pin CANL
15
25
35
kΩ
Ri(cm)(m)
matching between
pin CANH and pin CANL
common mode input
resistance
VCANH = VCANL
−3
0
+3
%
Ri(dif)
differential input resistance
25
50
75
kΩ
Ci(CANH)
input capacitance at
pin CANH
VTXD = VCC; not tested −
7.5
20
pF
Ci(CANL)
input capacitance at
pin CANL
VTXD = VCC; not tested −
7.5
20
pF
Ci(dif)
ILI(CANH)
differential input capacitance VTXD = VCC; not tested −
3.75
10
pF
input leakage current at
VCC = 0 V; VCANH = 5 V 100
170
250
µA
pin CANH
ILI(CANL)
input leakage current at
VCC = 0 V; VCANL = 5 V 100
170
250
µA
pin CANL
Thermal shutdown
Tj(sd)
shutdown junction
temperature
155
165
180
°C
Timing characteristics (see Figs.6 and 7)
td(TXD-BUSon)
td(TXD-BUSoff)
td(BUSon-RXD)
td(BUSoff-RXD)
tdom(TXD)
delay TXD to bus active
delay TXD to bus inactive
delay bus active to RXD
delay bus inactive to RXD
TXD dominant time for
time-out
VS = 0 V
VS = 0 V
VS = 0 V
VS = 0 V
VTXD = 0 V
25
55
110
ns
25
60
95
ns
20
50
110
ns
45
95
155
ns
250
450
750
µs
Notes
1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at 125 °C
ambient temperature for dies on wafer level and in addition to this 100 % tested at 25 °C ambient temperature for
cased products, unless specified otherwise.
2. For bare die, all parameters are only guaranteed if the backside of the bare die is connected to ground.
2003 Oct 22
7
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