TLP629-4 데이터 시트보기 (PDF) - Toshiba
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TLP629-4 Datasheet PDF : 7 Pages
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Absolute Maximum Ratings (Ta = 25°C)
TLP629,TLP629-2,TLP629-4
Characteristic
Forward current
Forward current derating
Pulse forward current
Reverse voltage
Diode power dissipation
Diode power dissipation derating
Collector-emitter voltage
Emitter-collector voltage
Collector current
Collector power dissipation (1 circuit)
Collector power dissipation derating
(1 circuit, Ta ≥ 25°C)
Storage temperature range
Operating temperature range
Lead soldering temperature (10 s)
Total package power dissipation (1 circuit)
Total package power dissipation derating
(Ta≥25°C, 1 circuit))
Isolation voltage
(Note 1)
Symbol
IF
ΔIF / °C
IFP
VR
PD
△PD /°C
VCEO
VECO
IC
PC
Rating
TLP629
TLP629-2,
TLP629-4
150
-1.5 (Ta ≥ 25°C)
1 (100 μs pulse, 100pps)
5
200
-2.0(Ta ≥ 25°C)
55
7
80
150
100
ΔPC / °C
-1.5
-1.0
Tstg
-55 to 125
Topr
-55 to 100
Tsol
260
PT
250
200
ΔPT / °C
-2.5
-2.0
BVS
5000 (AC, 60 s, RH ≤ 60 %)
Unit
mA
mA / °C
A
V
mW
mW/°C
V
V
mA
mW
mW / °C
°C
°C
°C
mW
mW / °C
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two terminal: LED side pins shorted together, and detector side pins shorted together.
Recommended Operating Conditions
Characteristics
Symbol
Min Typ. Max Unit
Supply voltage
Forward current
Collector current
Operating temperature
VCC
IF
IC
Topr
―
5
24
V
―
20 120 mA
―
1
10
mA
-25
―
85
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
© 2019
2
Toshiba Electronic Devices & Storage Corporation
2019-06-24
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