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CDP68HC68T1M2Z(2006) 데이터 시트보기 (PDF) - Intersil

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CDP68HC68T1M2Z Datasheet PDF : 24 Pages
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Ordering Information
PART NUMBER
PART MARKING
TEMP
RANGE
(°C)
PKG
PACKAGE DWG. #
CDP68HC68T1E CDP68HC68T1E -40 to 85 16 Ld PDIP E16.3
CDP68HC68T1EZ CDP68HC68T1EZ -40 to 85 16 Ld PDIP** E16.3
(Note)
(Pb-free)
CDP68HC68T1M* 68HC68T1M
-40 to 85 20 Ld SOIC M20.3
CDP68HC68T1MZ* 68HC68T1MZ
(Note)
-40 to 85 20 Ld SOIC M20.3
(Pb-free)
CDP68HC68T1M2* HC68T1M2
-40 to 85 16 Ld SOIC M16.3
CDP68HC68T1M2Z* HC68T1M2Z
(Note)
-40 to 85 16 Ld SOIC M16.3
(Pb-free)
*Add “96” suffix for taoe and reel.
**Pb-free PDIPs can be used for through hole wave solder processing only.
They are not intended for use in Reflow solder processing. applications.
Pin number references throughout this specification refer to the 16 lead
PDIP/SOIC. See pinouts for cross reference.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb
and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the
Pb-free requirements of IPC/JEDEC J STD-020.
2
FN1547.7
March 17, 2006

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