TS971 데이터 시트보기 (PDF) - STMicroelectronics
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TS971 Datasheet PDF : 17 Pages
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TS971-TS972-TS974
3
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
3.1
SOT23-5 package information
Figure 13. SOT23-5 package mechanical drawing
Table 4.
Ref.
A
A1
A2
b
C
D
E
E1
e
e1
L
SOT23-5 package mechanical data
Millimeters
Min.
Typ.
Max.
0.90
1.45
0.00
0.15
0.90
1.30
0.35
0.50
0.09
0.20
2.80
3.00
2.60
3.00
1.50
1.75
0.95
1.9
0.35
0.55
Min.
35.4
0.00
35.4
13.7
3.5
110.2
102.3
59.0
13.7
Mils
Typ.
37.4
74.8
Max.
57.1
5.9
51.2
19.7
7.8
118.1
118.1
68.8
21.6
7/17
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