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TSV992 데이터 시트보기 (PDF) - STMicroelectronics

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TSV992 Datasheet PDF : 18 Pages
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Package information
3
Package information
TSV991-TSV992-TSV994
Note:
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
All packages are Moisture Sensitivity Level 1 as per Jedec J-STD-020-C, except SO-14
which is Jedec level 3.
10/18

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