UJA1065 데이터 시트보기 (PDF) - NXP Semiconductors.
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UJA1065 Datasheet PDF : 76 Pages
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NXP Semiconductors
UJA1065
High-speed CAN/LIN fail-safe system basis chip
3. Ordering information
Table 1. Ordering information
Type number[1] Package
Name
UJA1065TW
HTSSOP32
Description
Version
plastic thermal enhanced thin shrink small outline package; 32 leads; SOT549-1
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
[1] UJA1065TW/5V0 is for the 5 V version; UJA1065TW/3V3 is for the 3.3 V version.
4. Block diagram
SENSE 31
32
BAT42
27
BAT14
29
SYSINH
V3 30
INH/LIMP 17
INH
INTN
WAKE
TEST
SCK
SDI
SDO
SCS
7
18
WAKE
16
CHIP
TEMPERATURE
11
9
10
SPI
12
RTLIN 26
25
LIN
3
TXDL
RXDL 5
GND 23
Fig 1. Block diagram
BAT
MONITOR
V1
V2
UJA1065
4
V1
20
V2
SBC
FAIL-SAFE
SYSTEM
V1 MONITOR
RESET/EN
WATCHDOG
6 RSTN
8 EN
OSCILLATOR
GND SHIFT
DETECTOR
LIN
BAT42 BAT42
V2
HIGH
SPEED
CAN
24 SPLIT
21 CANH
22
CANL
13 TXDC
14 RXDC
001aac305
UJA1065_7
Product data sheet
Rev. 07 — 25 February 2010
© NXP B.V. 2010. All rights reserved.
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