UPD16886MA-6A5-E1 데이터 시트보기 (PDF) - NEC => Renesas Technology

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UPD16886MA-6A5-E1

MONOLITHIC 1.5-CHANNEL H BRIDGE DRIVER CIRCUIT FOR CAMERAS

NEC => Renesas Technology 

µPD16886

RECOMMENDED SOLDERING CONDITIONS

The µPD16886 should be soldered and mounted under the following recommended conditions.

For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E). For soldering methods and conditions other than those recommended below,

contact an NEC sales representative.

Surface Mounting Type Soldering Conditions

Soldering Method

Soldering Conditions

Infrared reflow

Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),

Count: Three times or less, Exposure limit: None, Flux: Rosin-based flux with low

chlorine content (chlorine 0.2Wt% or below) is recommended

VPS

Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher), Count:

Three times or less, Exposure limit: None, Flux: Rosin-based flux with low chlorine

content (chlorine 0.2Wt% or below) is recommended

Wave soldering

Package peak temperature: 260°C, Time: 10 seconds max., Preheating temperature:

120°C or lower, Count: Once, Flux: Rosin-based flux with low chlorine content (chlorine

0.2Wt% or below) is recommended

Note Do not use different soldering methods together.

Recommended

Condition Symbol

IR35-00-3

VP15-00-3

WS60-00-1

Data Sheet S14844EJ2V0DS

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