SGA-9189 데이터 시트보기 (PDF) - Stanford Microdevices

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SGA-9189

Reliability Qualification Report

Stanford Microdevices 

SGA-9189 Reliability Qualification Report

Junction Temperature Determination

One key issue in performing the qualification testing is to accurately determine the

junction temperature of the device. Stanford Microdevices uses a 3µm spot size infrared

camera that allows a device to be measured at its normal operational parameters. The

3µm spot size allows for very good resolution compared to the heated area of the

transistor, which in this case is approximately 1-2µm. The results for the device, running

at maximum operational current of 180mA, a device voltage of 5.0V, and a base plate

lead temperature of 85.5oC.

Tlead = 85C

Id = 180mA

Vd = 5.00V

Tj = 125C

Figure 2: Infrared Thermal Image of SGA 9189, Vd = 5.0V, Id = 180mA, Tlead = 85C

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