SGA-9189 데이터 시트보기 (PDF) - Stanford Microdevices

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SGA-9189

Reliability Qualification Report

Stanford Microdevices 

SGA-9189 Reliability Qualification Report

Operational and Accelerated Life Testing

The purpose of the operational life test is to statistically show that the product operated at

125oC will be reliable. This is accomplished by operating several hundred devices for a

total test time of 1000 hours. The results for this test are expressed in device hours which

are calculated by multiplying the total number of devices passing by the number of hours

tested.

Operational Life Test Results

The results for SGA-9189 High Temperature Operating Life Test are as follows:

Group

Test Time Quantity Quantity

(hours)

In

Out

Device

Hours

A2

1000

189

189

189,000

Table 2: High Temperature Operational Life Test Results

Accelerated Life Test Results

The following data demonstrates the results from accelerated life tests performed on the

Stanford 4A SiGe HBT Process. The test was performed on 77 units running at a peak

junction temperature of 195oC. The test exceeded 10,000 hours (1.14 years) with no

failures. The FIT rate / MTTF calculation can be found below. The FIT rates were

generated assuming 1 failure. In reality, there were no failures, making this a very

conservative calculation.

Stanford Microdevices Process 4ASiGe HBT

FIT Rate / MTTF Calculation

SGA Series Devices

Parameters

*Ea = 0.7 eV

Junction Temp C FIT Rate MTTF (hrs)

55

0.053 1.89E+10

125

4.136 2.42E+08

*The Ea of 0.7eV is conservative, 0.85eV is the activation energy for electomigration which is assumed to be the primary failure mechanism for

the SiGe process.

**Stanford Microdevices does not assume any liability arising from the use of this data.

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