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UPD161602AP 데이터 시트보기 (PDF) - NEC => Renesas Technology

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UPD161602AP Datasheet PDF : 23 Pages
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2. PIN CONFIGURATION (Pad Layout)
Chip size: 16980 x 1620 µm2
Bump size (Input/VCOM/test/dummy): 86 x 80 µm2
Bump size (Output): 33 x 120 µm2
Alignment Mark (µm)
X: –8284.4 Y: 600
X: 8284.4 Y: 600
397
398
Y(-
X(+
407
408
60 µm
72 µm
72 µm
72 µm
60 µm
72 µm
µPD161602A/B
1 510
509
500
499
Driver output pad
40 µm plover
33 µm
Bump size
3960 µm2
35.5 µm
Input/VCOM/test/dummy
pad
Bump size
6880 µm2
80 µm
Data Sheet S15381EJ1V0DS
3

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