2. PIN CONFIGURATION (Pad Layout)
Chip size: T.B.D.
Bump size: INPUT/VCOM/TEST/DUMMY: 50 x 75 µm2
OUTPUT: 35 x 100 µm2
Remark T.B.D.: To be determined.
Alignment Mark (Unit: µm)
X Coordinate Y Coordinate
Alignment1 Aluminum (core)
10768.0
441.0
Alignment2
Bump (core)
Aluminum (core)
Bump (core)
10768.0
−10768.0
−10768.0
366.0
441.0
366.0
Remark The figures are rounded off in 0.5 µm units.
Alignment2
Driver output side
Input/output side
50 µm
50 µm
50 µm
50 µm
µPD161831
Alignment1
Alminum
Bump
Preliminary Product Information S16269EJ2V0PM
3