UPD70108C 데이터 시트보기 (PDF) - NEC => Renesas Technology

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UPD70108C

QUARTERLY MICROPROCESSOR/MICROCOMPUTER RELIABILITY REPORT

NEC => Renesas Technology 

NEC Electronics Inc.

Roseville Manufacturing

Table 1. Reliability Tests

The major reliability tests performed by NEC consist of high-temperature bias (HTB), 85°C/85% relative humidity (T/H),

high-temperature storage life (HTSL), and high-humidity storage life (HHSL) tests. Additionally, various environmental

and mechanical tests are performed. This table shows the conditions of the various life tests, environmental tests, and

mechanical tests.

Test Item

High-temperature bias

life

High-temperature storage

life

Temperature and

humidity life

Symbol

HTB

HTSL

T/H

High-humidity storage

life

Pressure cooker

HHSL

PCT

Temperature cycle

T/C

Lead fatigue

LI

Solderability

SD

Soldering heat

TS

Temperature cycle

Thermal shock

MIL-STD 883C Method

1005

1008

Condition

TA = 125°C,

VCC = 5.5 V.

TA = 150°C.

Remarks

Note 1

Note 1

1010

2004

2003

Note 3

1010

1011

TA = 85°C,

RH = 85%.

VDD = 5.5 V, alternate

pin bias.

TA = 85°C,

RH = 85%.

TA = 125°C,

RH = 100%

P = 2.3 atm.

−65° to 150°C, 1 hour/

cycle.

125g (DIP) 250g (QFP),

three bends, 90°, without

breaking.

TA = 230°C, 5 sec, rosin-

based flux.

260°C, 10 sec, rosin

based flux.

215°C VPS

235°C, IR reflow

10 cycles, −65° to 150°C.

15 cycles, 0° to 100°C.

Notes 1, 2

Notes 1, 2

Notes 1, 2

Note 1

Note 4

Note 5

DIP

PLCC

QFP

Note 1

Notes:

1. Electrical test per data sheet is performed. Devices that exceed the data sheet limits are considered rejects.

2. Pretreatment as specified.

3. MIL-STD 750A, method 2031.

4. Broken lead is considered a reject.

5. Less than 95% coverage is considered a reject.

4

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