W24L011A 데이터 시트보기 (PDF) - Winbond

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W24L011A

128K X 8 HIGH SPEED CMOS STATIC RAM

Winbond 

W24L011A

PACKAGE DIMENSIONS

32-pin SOJ (300 mil)

32

1

D

S

B

e

b

Seating Plane

17

E He

16

Symbol

A

A1

A2

B

b

c

D

E

e

e1

He

L

S

Y

θ

Dimension in Inches

Dimension in mm

Min.

__

0.020

Nom.

__

__

Max.

0.140

__

Min.

__

0.508

Nom.

__

__

Max.

3.556

__

0.095 0.100 0.105 2.413 2.540 2.667

0.026 0.028 0.032 0.660 0.711 0.813

0.016 0.018 0.022 0.406 0.457 0.559

0.008 0.010 0.014 0.203 0.254 0.356

0.815 0.825 0.835 20.701 20.955 21.209

0.295 0.300 0.305 7.493 7.620 7.747

0.044 0.050 0.056 1.118 1.270 1.422

0.247 0.267 0.287 6.274 6.782 7.290

0.325

0.080

__

__

0

0.335

__

__

__

__

0.345

__

0.045

0.004

10

8.255

2.032

__

__

0°

8.509

__

__

__

__

8.763

__

1.143

0.102

10°

A2 A

c

L

A1

Y

e1

θ

32-pin SOJ (400 mil)

32

17

HE

E

1

16

D

s

b

b1

Seating Plane

A2

A

e

A1

L

θ

y

c

e1

Dimension in inches Dimension in mm

Symbol Min. Nom. Max. Min. Nom. Max.

A

0.131 0.138 0.145 3.33 3.51 3.68

A 1 0.025

0.635

A 2 0.105 0.110 0.115 2.67 2.79 2.91

b 1 0.026 0.028 0.032 0.66 0.71 0.81

b

0.016 0.018 0.020 0.41 0.46 0.51

c

0.006 0.008 0.011 0.15 0.20 0.28

D

0.820 0.825 0.830 20.83 20.96 21.08

E

0.395 0.400 0.405 10.03 10.16 10.29

e

0.044 0.050 0.056 1.12 1.27 1.42

e1

0.360 0.37 0.380 9.15 9.40 9.65

HE 0.435 0.440 0.445 11.05 11.18 11.31

L

0.082

2.08

S

0.045

1.14

y

0.004

0.10

θ

-5

2

6

-5

2

6

Notes:

1. Dimension D Max & S include mold flash

or tie bar burrs.

2. Dimension b does not include dambar

protrusion/intrusion.

3. Dimension D & E include mold mismatch

and are determined at the mold parting line.

4. Controlling dimension: Inches

5. General appearance spec. should be based

on final visual inspection spec.

-8-

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