25Q128BVCA 데이터 시트보기 (PDF) - Winbond

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25Q128BVCA

3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

Winbond 

W25Q128BV

3. PACKAGE TYPES AND PIN CONFIGURATIONS

W25Q128BV is offered in an 8-pad WSON 8x6-mm (package code E), a 16-pin SOIC 300-mil (package

code F) and a 24-ball 8x6-mm TFBGA (package code C) as shown in Figure 1a-c respectively. Package

diagrams and dimensions are illustrated at the end of this datasheet.

3.1 Pad Configuration WSON 8x6-mm

Top View

/CS

18

VCC

DO (IO1)

/WP (IO2)

GND

27

36

45

/HOLD (IO3)

CLK

DI (IO0)

Figure 1a. W25Q128BV Pad Assignments, 8-pad WSON 8x6-mm (Package Code E)

3.2 Pad Description WSON 8x6-mm

PAD NO.

1

2

3

4

5

6

7

8

PAD NAME

/CS

DO (IO1)

/WP (IO2)

GND

DI (IO0)

CLK

/HOLD (IO3)

VCC

I/O

FUNCTION

I

Chip Select Input

I/O

Data Output (Data Input Output 1)*1

I/O

Write Protect Input ( Data Input Output 2)*2

Ground

I/O

Data Input (Data Input Output 0)*1

I

Serial Clock Input

I/O

Hold Input (Data Input Output 3)*2

Power Supply

*1: IO0 and IO1 are used for Standard and Dual SPI instructions

*2: IO0 – IO3 are used for Quad SPI instructions

-6-

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