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W83176G-400 데이터 시트보기 (PDF) - Winbond

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W83176G-400 Datasheet PDF : 12 Pages
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W83176R-400/W83176G-400
CURRENT MODE DIFFERENTIAL BUFFER FOR PCI EXPRESS AND SATA
8. ORDERING INFORMATION
PART NUMBER
W83176R_400
W83176G-400
PACKAGE TYPE
28 PIN SSOP
28 PIN SSOP
(Lead free package)
PRODUCTION FLOW
Commercial, 0°C to +70°C
Commercial, 0°C to +70°C
9. HOW TO READ THE TOP MARKING
W83176R-400
28051234
510GBSA
W83176G-400
28051234
510GBSA
1st line: Winbond logo and the type number:
Normal part: W83176R-400, Lead free part: W83176G-400
2nd line: Tracking code 2 8051234
2: wafers manufactured in Winbond FAB 2
8051234: wafer production series lot number
3rd line: Tracking code 418 G B SA
510: packages made in '2005, week 10
G: assembly house ID; O means OSE, G means GR
B: IC revision
SA: Winbond Internal use
All the trademarks of products and companies mentioned in this datasheet belong to their
respective owners.
Publication Release Date: May, 2006
-7-
Revision 0.6

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