XC6222D501ER-G 데이터 시트보기 (PDF) - TOREX SEMICONDUCTOR
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XC6222D501ER-G Datasheet PDF : 26 Pages
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■PACKAGING INFORMATION (Continued)
● SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
XC6222
Series
2. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
評Ev価alu基ati板on レBoイardア(Uウniトt: m（単m) 位：mm）
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W)
25
600
166.67
85
240
700
600
500
400
300
200
100
0
25
Pd-TPad特vs性. Taグラフ
45
65
85
105
125
Ambie周nt T辺em温pe度ratTurae（T℃a (）℃)
23/26
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