XC6222D501ER-G 데이터 시트보기 (PDF) - TOREX SEMICONDUCTOR
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XC6222D501ER-G Datasheet PDF : 26 Pages
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XC6222 Series
■PACKAGING INFORMATION (Continued)
● SOT-89-5 Power Dissipation
Power dissipation data for the SOT-89-5 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
て
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 5 x 0.8 Diameter
2. Power Dissipation vs. Ambient Temperature
Evaluation Board (Unit: mm)
Board Mount (Tj max = 125℃)
Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W)
25
1300
76.92
85
520
1400
1200
1000
800
600
400
200
0
25
Pd-TaP特d性vsグ. Taラフ
45
65
85
105
125
Ambien周t T辺em温pe度ratTurae（T℃a ）(℃)
24/26
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