XP1005 데이터 시트보기 (PDF) - Mimix Broadband
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XP1005 Datasheet PDF : 7 Pages
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35.0-43.0 GHz GaAs MMIC
Power Amplifier
May 2005 - Rev 05-May-05
Mechanical Drawing
1.825
(0.072)
1.163
(0.046)
1.562
(0.062)
1.960
(0.077)
2
3
4
2.362
(0.093)
5
2.764
(0.109)
6
3.162
(0.125)
7
P1005
0.831
(0.033)
1
8
0.478
(0.019)
0.0
0.0
14
1.163
(0.046)
13
1.562
(0.062)
12
1.960
(0.077)
11
2.362
(0.093)
10
2.764
(0.109)
9
3.162 3.526
(0.125) (0.139)
(Note: Engineering designator is 38H4PBA0157)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.987 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg2)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vg3A)
Bond Pad #5 (Vd3A)
Bond Pad #6 (Vg4A)
Bond Pad #7 (Vd4A)
Bond Pad #8 (RF Out)
Bond Pad #9 (Vd4B)
Bond Pad #10 (Vg4B)
Bond Pad #11 Vd3B)
Bond Pad #12 (Vg3B)
Bond Pad #13 (Vd1)
Bond Pad #14 (Vg1)
Bias Arrangement
Vg2,3
Vd2,3
Bypass Capacitors - See App Note [2]
Vg2,3 Vd2,3
2
3
4
5
6
7
RF In 1
14
13
12
11
10
Vg1
Vg4
Vd1
8 RF Out
9
Vd4
RF In
Vg1
Vd1
XP1005
Vg4 Vd4
RF Out
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 4 of 7
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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