MC100EP33D(2002) 데이터 시트보기 (PDF) - ON Semiconductor

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MC100EP33D
(Rev.:2002)

3.3V / 5V ECL ÷4 Divider

ON Semiconductor 

MC10EP33, MC100EP33

PACKAGE DIMENSIONS

–X–

A

SO–8

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751–07

ISSUE AA

8

5

B

S

0.25 (0.010) M Y M

1

4

–Y–

K

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER

SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN

EXCESS OF THE D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

6. 751-01 THRU 751-06 ARE OBSOLETE. NEW

STANDAARD IS 751-07

–Z–

H

G

D

C

SEATING

PLANE

N X 45 _

0.10 (0.004)

M

0.25 (0.010) M Z Y S X S

MILLIMETERS

INCHES

DIM MIN MAX MIN MAX

A 4.80 5.00 0.189 0.197

B 3.80 4.00 0.150 0.157

C 1.35 1.75 0.053 0.069

D 0.33 0.51 0.013 0.020

G

1.27 BSC

0.050 BSC

H 0.10 0.25 0.004 0.010

J

J 0.19 0.25 0.007 0.010

K 0.40 1.27 0.016 0.050

M 0_ 8_ 0_ 8_

N 0.25 0.50 0.010 0.020

S 5.80 6.20 0.228 0.244

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