Z0103MN0 데이터 시트보기 (PDF) - NXP Semiconductors.
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Z0103MN0 Datasheet PDF : 15 Pages
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NXP Semiconductors
8. Package outline
Plastic surface-mounted package with increased heatsink; 4 leads
Z0103MN0
4Q Triac
SOT223
D
B
E
A
X
c
y
HE
b1
4
vM A
A1
1
2
3
e1
bp
e
wM B
Q
A
Lp
detail X
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1 bp b1
c
D
E
e
e1 HE Lp
Q
v
w
y
mm
1.8 0.10 0.80 3.1 0.32 6.7
1.5 0.01 0.60 2.9 0.22 6.3
3.7
3.3
4.6
2.3
7.3
6.7
1.1
0.7
0.95
0.85
0.2
0.1
0.1
OUTLINE
VERSION
IEC
SOT223
REFERENCES
JEDEC
JEITA
SC-73
Fig 15. Package outline SOT223 (SOT223)
Z0103MN0
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 3 January 2011
EUROPEAN
PROJECTION
ISSUE DATE
04-11-10
06-03-16
© NXP B.V. 2011. All rights reserved.
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