STTH3R02(2006) 데이터 시트보기 (PDF) - STMicroelectronics
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STTH3R02 Datasheet PDF : 9 Pages
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STTH3R02
Package information
Table 7. SMC dimensions
Ref.
E1
A1
D
A2
b
E
c
E
A1
E1
C
E2
L
A2
b
E2
D
L
Figure 15. SMC footprint (dimensions in mm)
Dimensions
Millimeters
Inches
Min.
1.90
0.05
2.90
0.15
7.75
6.60
4.40
5.55
0.75
Max.
2.45
0.20
3.2
0.41
8.15
7.15
4.70
6.25
1.60
Min.
0.075
0.002
0.114
0.006
0.305
0.260
0.173
0.218
0.030
Max.
0.096
0.008
0.126
0.016
0.321
0.281
0.185
0.246
0.063
2.20
4.25
2.20
3.30
8.65
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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