DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

SIA430DJ-T4-GE3 데이터 시트보기 (PDF) - Vishay Semiconductors

부품명
상세내역
제조사
SIA430DJ-T4-GE3
Vishay
Vishay Semiconductors Vishay
SIA430DJ-T4-GE3 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
N-Channel 20 V (D-S) MOSFET
SiA430DJ
Vishay Siliconix
PRODUCT SUMMARY
VDS (V)
RDS(on) ()
0.0135 at VGS = 10 V
20
0.0185 at VGS = 4.5 V
ID (A)b, c
12a
10.8
Qg (Typ.)
5.3 nC
FEATURES
• TrenchFET® Power MOSFET
• Thermally Enhanced PowerPAK®
SC-70 Package
- Small Footprint Area
RoHS
COMPLIANT
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
PowerPAK SC-70-6L-Single
D
6
D
5
2.05 mm S
4
1
D
2
D
3
G
S
2.05 mm
APPLICATIONS
• Load Switch
Marking Code
Part # code
AKX
XXX
Lot Traceability
and Date code
Ordering Information:
SiA430DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
SiA430DJ-T4-GE3 (Lead (Pb)-free and Halogen-free)
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
20
V
VGS
± 20
TC = 25 °C
12a
Continuous Drain Current (TJ = 150 °C)
TC = 70 °C
TA = 25 °C
ID
12a
12a, b, c
TA = 70 °C
10.1b, c
A
Pulsed Drain Current
IDM
40
Continuous Source-Drain Diode Current
TC = 25 °C
TA = 25 °C
IS
12a
2.9b, c
TC = 25 °C
19.2
Maximum Power Dissipation
TC = 70 °C
TA = 25 °C
PD
12.3
3.5b, c
W
TA = 70 °C
2.2b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
TJ, Tstg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambientb, f
t5s
RthJA
28
Maximum Junction-to-Case (Drain)
Steady State
RthJC
5.3
36
°C/W
6.5
Notes:
a. Package limited
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
Document Number: 68685
For technical questions, contact: pmostechsupport@vishay.com
www.vishay.com
S13-0116-Rev. B, 21-Jan-13
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]