FSA831 데이터 시트보기 (PDF) - Fairchild Semiconductor
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FSA831 Datasheet PDF : 3 Pages
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Physical Dimensions
0.10 C
2X
2.10
A
B
PIN1 IDENT IS
2X LONGER THAN
OTHER LINES
TOP VIEW
1.60
0.10 C
2X
0.05 C
C
SIDE VIEW
0.55 MAX
0.05 C
0.05
0.00
1.62
(0.11)
0.56
1.12
KEEPOUT ZONE, NO TRACES
OR VIAS ALLOWED
0.50
(0.35) 10X
(0.25) 10X
RECOMMENDED LAND PATTERN
(0.20)
0.35
0.25
DETAIL A
D
0.65
0.55
0.35
0.25
1
(0.36)
4
0.56
(0.15)
0.35
0.25
DETAIL A 2X SCALE
(0.29)
10
5
9
0.50
6
0.35
0.25
9X
0.25
0.15
9X
1.62
0.10 C A B
0.05 C
ALL FEATURES
BOTTOM VIEW
NOTES:
A. PACKAGE CONFORMS TO JEDEC
REGISTRATION MO-255, VARIATION UABD .
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. PRESENCE OF CENTER PAD IS PACKAGE
SUPPLIER DEPENDENT. IF PRESENT IT
IS NOT INTENDED TO BE SOLDERED AND
HAS A BLACK OXIDE FINISH.
E. DRAWING FILENAME: MKT-MAC10Arev5.
Figure 10. 10-Lead, MicroPak™
Part Number Top Mark
FSA831L10X
KY
Operating Temperature Range
-40 to 85°C
Package Description
10-Lead, MicroPak™ 1.6 x 2.1mm,
0.5mm Pitch
Packing
Method
Tape & Reel
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2011 Fairchild Semiconductor Corporation
FSA831 • Rev. 1.0.2
10
www.fairchildsemi.com
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