LTC4440AI-5 데이터 시트보기 (PDF) - Linear Technology

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LTC4440AI-5

High Speed, High Voltage, High Side Gate Driver

Linear Technology 

LTC4440A-5

Electrical Characteristics The ● denotes specifications which apply over the specified operating

junction temperature range, otherwise specifications are at TA = 25°C. VCC = VBOOST = 6V, VTS = GND = 0V, unless otherwise noted.

(Note 2)

SYMBOL PARAMETER

Input Signal (INP)

VIH

High Input Threshold

VIL

Low Input Threshold

VIH – VIL Input Voltage Hysteresis

IINP

Input Pin Bias Current

Output Gate Driver (TG)

VOH

High Output Voltage

VOL

Low Output Voltage

IPU

Peak Pull-Up Current

RDS

Output Pull-Down Resistance

Switching Timing

tr

Output Rise Time

tf

Output Fall Time

tPLH

Output Low-High Propagation Delay

tPHL

Output High-Low Propagation Delay

CONDITIONS

INP Ramping High

INP Ramping Low

ITG = –10mA, VOH = VBOOST – VTG

ITG = 100mA

10% – 90%, CL = 1nF

10% – 90%, CL = 10nF

10% – 90%, CL = 1nF

10% – 90%, CL = 10nF

MIN TYP MAX UNITS

l 1.2

1.55

2

V

l 0.8

1.25

1.6

V

0.350

V

±0.01 ±2

µA

0.7

V

l

185 400

mV

l 0.7

1.1

A

l

1.85

4

Ω

10

ns

100

ns

7

ns

70

ns

l

35

80

ns

l

33

80

ns

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: The LTC4440A-5 is tested under pulsed load conditions such

that TJ ≈ TA. The LTC4440AI-5 is guaranteed over the –40°C to 125°C

operating junction temperature range, The LTC4440AH-5 is guaranteed

over the –40°C to 150°C operating junction temperature range and

the LTC4440AMP-5 is tested and guaranteed over the –55°C to 150°C

operating junction temperature range.

High junction temperatures degrade operating lifetimes; operating lifetime

is derated to junction temperatures greater than 125°C. Note that the

maximum ambient temperature consistent with these specifications is

determined by specific operating conditions in conjunction with board

layout, the rated package thermal impedance and other environment

factors.

Note 3: TJ is calculated from the ambient temperature TA and power

dissipation PD according to the following formula:

TJ = TA + (PD • θJA°C/W)

Continuous operation above the specified absolute operating junction

temperature may impair device reliability or permanently damage the

device.

Note 4: Failure to solder the exposed pad of the MS8E package to the PC

board will result in a thermal resistance much higher than 40°C/W.

For more information www.linear.com/LTC4440A-5

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