SP1001 데이터 시트보기 (PDF) - Littelfuse, Inc
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SP1001 Datasheet PDF : 7 Pages
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TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Soldering Parameters
Reflow Condition
Pb – Free assembly
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (min to max) (ts)
Average ramp up rate (Liquidus) Temp
(TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
- Temperature (tL)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peak Temperature (TP)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes max.
260°C
TP
TL
TS(max)
TS(min)
25
Ramp-up
Preheat
tS
time to peak temperature
tP
Critical Zone
TL to TP
tL
Ramp-down
Time
Part Numbering System
SP1001-0* * T G
TVS Diode Arrays
(SPA® Diodes)
Series
Number of Channels
02 = 2 Channel
04 = 4 Channel
05 = 5 Channel
G= Green
T= Tape & Reel
Package
J = SC70-3, SC70-5 or SC70-6
X = SOT553 or SOT563
V = SOT963
Part Marking System
A* *
A**
Product Series
A = SP1001 series
Number of Channels
(varies)
Assembly Site
(varies)
Ordering Information
Part Number
SP1001-02JTG
SP1001-02XTG
Package
SC70-3
SOT553
SP1001-04JTG
SP1001-04XTG
SC70-5
SOT553
SP1001-05JTG
SC70-6
SP1001-05VTG SOT963
SP1001-05XTG SOT563
Marking
A*2
A*2
A*4
A*4
A*5
A*5
A*5
Min. Order Qty.
3000
3000
3000
3000
3000
8000
3000
Product Characteristics
Lead Plating
Lead Material
Matte Tin (SC70-x) Pre-Plated Frame
(SOT5x3, SOT963)
Copper Alloy
Lead Coplanarity
Substitute
Material
Body Material
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/23/17
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