CXA2500M 데이터 시트보기 (PDF) - Sony Semiconductor
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CXA2500M Datasheet PDF : 11 Pages
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Package Outline
Unit: mm
CXA2500M
24
24PIN SOP (PLASTIC)
+ 0.4
15.0 – 0.1
13
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
12
1.27
+ 0.1
0.2 – 0.05
CXA2500M/N
CXA2500N
± 0.12 M
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-24P-L01
∗SOP024-P-0300-A
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY/PHENOL RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY / 42ALLOY
PACKAGE WEIGHT
0.3g
24PIN SSOP(PLASTIC)
∗7.8 ± 0.1
24
13
A
+ 0.2
1.25 – 0.1
0.1
1
b
B
0.13 M
12
0.65
0.1 ± 0.1
+ 0.1
b=0.22 – 0.05
(0.22)
b=0.22 ± 0.03
0° to 10°
DETAIL B : SOLDER
DETAIL B : PALLADIUM
NOTE: Dimension “∗” does not include mold protrusion.
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
SSOP-24P-L01
SSOP024-P-0056
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
42/COPPER ALLOY
PACKAGE MASS
0.1g
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
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