KBMF01SC6(2004) 데이터 시트보기 (PDF) - STMicroelectronics
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KBMF01SC6
(Rev.:2004)
(Rev.:2004)
STMicroelectronics
KBMF01SC6 Datasheet PDF : 8 Pages
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KBMF
Figure 13: SOT23-6L Package Mechanical Data
A1
L
H
E
θ
c
A2 A
D
b
ee
REF.
A
A1
A2
b
C
D
E
e
H
L
θ
DIMENSIONS
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
0.90
1.45 0.035
0.057
0
0.10 0
0.004
0.90
1.30 0.035
0.051
0.35
0.50 0.014
0.02
0.09
0.20 0.004
0.008
2.80
3.05 0.110
0.120
1.50
1.75 0.059
0.069
0.95
0.037
2.60
3.00 0.102
0.118
0.10
0.60 0.004
0.024
10°
10°
Figure 14: SOT23-6L Foot print dimensions
(in millimeters)
0.60
1.20
3.50 2.30
0.95
1.10
Table 4: Mechanical Specifications
Lead plating
Lead plating thickness
Lead material
Lead coplanarity
Body material
Flammability
Tin-lead
5µm min.
25µm max.
Sn / Pb
(70% to 90%Sn)
10µm max
Molded epoxy
UL94V-0
Table 5: Ordering Information
Ordering code
KBMF01SC6
Marking
KM1
Package
SOT23-6L
Weight
16.7 mg
Base qty
3000
Delivery mode
Tape & reel
Table 6: Revision History
Date
Feb-2003
28-Oct-2004
Revision
1D
2
Description of Changes
Last update.
SOT23-6L package dimensions change for reference “D”
from 3.0 millimeters (0.118 inches) to 3.05 millimeters
(0.120 inches).
7/8
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