EMIF10-COM01 데이터 시트보기 (PDF) - STMicroelectronics

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EMIF10-COM01

EMI FILTER INCLUDING ESD PROTECTION

STMicroelectronics 

EMIF10-COM01

APLAC MODEL

in

MODEL = demif10

200R

sub

out

MODEL = demif10

Demif10 model

BV = 7

IBV = 1m

CJO = 25p

M = 0.3333

RS = 1

VJ = 0.6

TT = 100n

PCB grounding recommendations

In order to ensure a good efficiency in terms of ESD protection and filtering behavior, we recommend to

implement microvias (100 µm dia.) between the GND bumps and the GND layer. GND bumps can be

connected together in PCB layer 1, and in addition, if possible, use through hole vias (200 um dia.) in both

sides of filter to improve contact to GND (layer). This layout will minimize the distance to the ground and

thus parasitic inductances. In addition, we recommend to have GND plane wherever possible.

ORDERING CODE

EMIF 10 - COM 01

EMI Filter

Nb of lines

Version

For communication

4/5

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